Chemtronics S200 Solder Wire 1 mm x 0.6 oz, Circuit Works Lead-Free Pocket Solder
Original price
$24.24
-
Original price
$24.24
Original price
$24.24
$24.24
-
$24.24
Current price
$24.24
Solder Wire, Form Flux-Cored Wire, Material Composition 96.5 Percent Tin, 3 Percent Silver, 0.5 Percent Copper, Wire Diameter 0.04 in, Weight 0.6 oz, Melting Temperature (Minimum) 419 Degrees F, Melting Temperature (Maximum) 424 Degrees F, Flux Type Rosin, Flux Classification ROL0, Application Lead Free Rework and Repair, Portable SAC 305 Alloy, Container Type Tube, Features Lead Free, Type ROL0 Flux per IPC J-STD-004, Flux Requirement Contains Flux Core, Spool Length 125 in
| Application | Lead Free Rework and Repair, Portable SAC 305 Alloy |
| Contents | 0.5% Copper, 3.0% Silver, 96.5% Tin, Rosin Core |
| Melting Range (Deg.) | 422 to 428 |
| Container Type | Tube |
| Standards | IPC J STD 004, RoHS Compliant |
| Flux Classification | ROL0 |
| Form | Flux-Cored Wire |
| Composition | 96.5% Tin, 3% Silver, 0.5% Copper |
| Features | Lead Free, Type ROL0 Flux per IPC J-STD-004 |
| Flux Requirement | Contains Flux Core |
| Flux Type | Rosin |
| Soldering Temperature Range | 419 Degrees F to 424 Degrees F |
| Melting Temperature (Maximum) | 424 Degrees F |
| Melting Temperature (Minimum) | 419 Degrees F |
| Weight | 0.6 oz |
| Material Composition | 96.5% Tin, 3% Silver, 0.5% Copper |
| Solder Composition | Tin-Copper-Silver |
| Maximum Brazing Temperature | 424 Degrees F |
| Minimum Brazing Temperature | 419 Degrees F |
| Minimum Soldering Temperature | 419 Degrees F |
| Item Weight | 0.6 oz |
| Maximum Soldering Temperature | 424 Degrees F |